India Advances Semiconductor Manufacturing with New MoU
In a significant boost to India's semiconductor industry, Intel, 3DGS Inc., and the Government of Odisha have signed a Memorandum of Understanding (MoU) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha. With a projected investment of $3.3 billion, this facility marks one of the largest high-technology investments in the nation, expected to create over 1,800 direct jobs. The initiative, part of the India Semiconductor Mission, aims to elevate India as a global hub for semiconductor manufacturing.
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