India's First 3D Semiconductor Packaging Unit Launched in Odisha
India's semiconductor ecosystem is set to receive a major boost with the launch of the country's first advanced 3D semiconductor packaging unit in Odisha. The Heterogeneous Integration Packaging Solutions project will position Odisha as a leading tech destination, supporting sectors like artificial intelligence and defence. Backed by investments from global tech leaders, this initiative aligns with Prime Minister Narendra Modi’s vision of an Atmanirbhar Bharat.
Source: Original Link