India's First 3D Semiconductor Packaging Unit Launched in Odisha

India's semiconductor ecosystem is set to receive a major boost with the launch of the country's first advanced 3D semiconductor packaging unit in Odisha. The Heterogeneous Integration Packaging Solutions project will position Odisha as a leading tech destination, supporting sectors like artificial intelligence and defence. Backed by investments from global tech leaders, this initiative aligns with Prime Minister Narendra Modi’s vision of an Atmanirbhar Bharat.

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APEDA Launches First Sea Shipment of Botanical-Infused Millet Foods to New Zealand

The Agricultural and Processed Food Products Export Development Authority (APEDA) facilitated the maiden sea shipment of botanical-infused, ready-to-cook millet functional foods from Karnataka to New Zealand. This milestone underscores the expanding opportunities for India's millet-based agricultural exports, bolstered by participation in APEDA-supported international trade fairs. Source: Original Link